Articles in Scholarly Journals [Incomplete List]

1. Robust Thermal Design for Power Device Package Using Response Surface Method and Monte Carlo Simulation
   Journal of Thermal Science and Technology, vol. 3, no. 3, pp. 452–460, 2008
2. Thermal studies on finned LSI packages using forced convection
   IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 12, no. 4, pp. 753–756, 1989