This paper discusses the preparation techniques which can be used for the examination of thick film resistor microstructures
by Transmission Electron Microscopy. The application of this technique, including High Voltage Electron
Microscopy and Electron Microscope Mass Analysis, to both Ruthenium Dioxide and Bismuth Ruthenate based
thick film resistors, is considered.

D. J. Pedder

Techniques for the Examination of Thick Film Resistor Microstructures by T.E.M.

This paper describes a new series of thick film resistors based on a ruthenium-compound semiconducting phase,
dispersed in a carefully selected and compatible glassy matrix. Analysis of the electrical properties of these resistors
indicates that the conducting networks present in the structure include ohmic, non-ohmic and insulating barriers.Experimental results on the resistors are discussed in terms of resistivity and TCR vs. firing parameters. The effect
of termination materials and resistor geometry, voltage coefficient of resistance, power loading and high voltage
properties are also discussed.

Sidney J. Stein

Cornelius  Huang

Allan S. Gelb

A High Voltage, High Performance Thick Film Resistor System

During the last few years, the use of hybrid integrated circuits in microwave radio links has increased significantly.
This paper reports on a range of microwave hybrid circuits now in production at our plant. These include transistor
high power amplifiers, low noise mixers and various other circuits. The hybrid technology has proven to be cost
competitive with the more conventional waveguide and coaxial technologies, and gives quite a few other advantages
as well. Among these, the standardization of packages and modules is discussed in some detail. The trend is now to
use the hybrid technology in VHF circuits as well. This opens up the possibility of integrating related functions in
one package. The production cost in this case must be related to printed circuit boards, and it remains to be seen if
there is anything to gain in this respect. However the reduction of the size of modules and the time for circuit
alignment will certainly give an improvement in the overall system cost. In order to reduce the cost of microwave
hybrid circuits, thick film technology is currently being investigated for use up to 15 GHz. There is probably no
specific upper frequency for thick film circuits, but the possibility of using conventional thick film technology
depends on the actual circuits under consideration. Preliminary results of this work are reported, together with a
cost comparison between thick film and thin film microwave hybrid circuits.

Per Chr. Malmin

Development and Production of Hybrid Circuits for Microwave Radio Links

This paper describes conduction processes in thick film resistors made from 1 M<mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mtext>&#x03A9;</mml:mtext></mml:math>/square and 10 M<mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mtext>&#x03A9;</mml:mtext></mml:math>/square pastes.
Conductivity as a function of temperature indicates activation energies in the order of 1 meV. At high fields,
conductivity is increased. These results are interpreted on the basis of a model where the main resistor characteristics
are determined by hopping conduction in a narrow impurity band in the glass phase of the resistor.

J.  Robertson

Conduction Processes in High Value Thick Film Resistors

Studies have been made of the adhesion of gold thin films on NiCr and Mo layers deposited on ceramic substrates.
It is shown that the ageing behaviour and the related long-term adhesion losses are complex processes and the
various contributing mechanisms are identified.

H.  Hieber

F.  Betke

K.  Pape

Ageing Tests on Gold Layers and Bonded Contacts

The paper deals with laser trimming of film resistors. The finite-difference solution of the electric field calculated by
a digital computer gives the total resistance and the inhomogeneous current distribution within the resistor area. The
current noise voltage was found to be proportional to the sum of reciprocal subareas wherein the current density is
approximately constant. Resistor trimming is modelled by finite increments of cut length to obtain the resistance
trim rate and the trim sensitivity.Known and new resistor geometries and cut configurations are compared (based on the same resistor area and
the same initial tolerance of &#177; 20&#37;) to find the optimal geometry depending on the ratio of the nominal resistance
value to the sheet resistivity. Diagrams are given leading to practical design rules not only for resistance trimming but
also for deterministic and functional tuning.

W.  Ulbrich

Resistor Geometry Comparison With Respect to Current Noise and Trim
Sensitivity

D. S. Campbell

Editorial

Mounting of I.C.&#39;s on thickfilm circuits by means of patterns on foil of a total thickness of about 30 microns is
described. The extreme flexibility of the foil and some well controlled characteristics of the thickfilm process
aid soldering of the chip with a reproducible low heat resistance to the substrate in a cheap and reliable way.

A.  van der Drift

K. F. Nickl Van Nikelsberg

Hybrid Interconnection of I.C.&#39;S by Means of Patterns on Flexible Tape

The generation and processing of data signal sequences in the gigabit range make high demands on circuitry and
technology. For this high-speed thick-film switching circuits have proved successful. With a suitable circuitry, which
is tailored to both the requirements of the subnanosecond range and the conditions of the thick-film technique, it is
possible to solve many problems connected with the generation and processing of data signals in the gigabit range.The conventional method of series-to-parallel conversion with shift registers can, however, not be applied at
justifiable costs with the present-day components. Therefore signal processing at the receiving end by bit error rate
measuring equipment at bit rates from 640 Mbit/s up to 1,28 Gbit/s is used to demonstrate hybrid-integrated thick-film
circuits which, in connection with coaxial and strip lines, allow the series-to-parallel conversion of high bit rates.The principle applied here uses lines as storing elements and high speed gates as switches. By supplying the data
signal as well as the shift and sampling clocks in a serial mode, it is possible to obtain a geometrically linear
arrangement of the thick-film circuits so that problems of clock supply and differing signal delays can be excluded.
The combination of a few extremely high-speed thick-film circuits with commercial monolithic circuits allows
series-to-parallel conversions to be performed in a simple, reliable and flexible way and in any conversion ratio.

G.  Hanke

Hybrid-Integrated Series-to-Parallel Converters for Gigabit Rates

A thick film hybrid transmitter for the radio tracking of wild animals is described. Weight considerations are of
prime importance for such transmitters and the system discussed uses thick film hybrid technology, together with a
solar cell power supply charging Cd&#x2013;Ni batteries.To reduce power consumption a pulsed system is used; the transmitter operating frequency is in the 72 MHz
band.

J. L. Aucouturier

A. Chaillou

G. Nicolas

R. Canivenc

R. Govaerts

R. Mertens

F. Lauwers

R. J. Van Overstraeten

M. Marques

Biotelemetry and Radiotracking of Wild Birds: Portable Device Using Solar Cells Power Supply

About this journal

Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

Journal profile

Meet the editorial board

Active and Passive Electronic Components maintains an Editorial Board of practicing researchers from around the world, to ensure manuscripts are handled by editors who are experts in the field of study.

Editor spotlight

Submit your proposal

Do you think there is an emerging area of research that really needs to be highlighted? Or an existing research area that has been overlooked or would benefit from deeper investigation? Raise the profile of a research area by leading a Special Issue.

Special Issues

Author guidelines

Editorial board

Databases and indexing

Active and Passive Electronic Components | Hindawi

title

Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

description

https://images.hindawi.com/journals/apec/apec.banner.jpg

twitter:card

twitter:description

twitter:site

twitter:title

twitter:url

twitter:image

Active and Passive Electronic Components

This Issue is now open for submissions.
Papers are published upon acceptance, regardless of the Special Issue publication date.