Research Article

A Reuse Evaluation for Solar-Cell Silicon Wafers via Shift Revolution and Tool Rotation Using Magnetic Assistance in Ultrasonic Electrochemical Micromachining

Figure 5

Amount of Si3N4 layer and epoxy film removed using different combinations of magnetic field strength and distance between the two magnets (phosphoric acid 25% wt, NaNO3 15% wt, PO4-3-P 5% wt, 60°C, 40 L/min, continuous DC, 150 A, 80 V, 100 kHZ/150 W, shift 800 rpm, and tool 900 rpm).
293859.fig.005a
(a) Amount of Si3N4 layer removed
293859.fig.005b
(b) Amount of epoxy film removed