Research Article
Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs
Table 1
Thermal conductivities and dimensions of packaging components.
| Packaging components | Materials | Sizes (mm) | Thermal conductivities (W/(m·K)) |
| Substrate | Al | | 237 | Insulating layer | —— | | 0.25 | Circuit layer | Cu | | 401 | Solder paste | SnAgCu | | 60 | Chip | Sapphire | | 50 | Lens | Glass | | 0.21 |
|
|