Active and Passive Electronic Components

Table of Contents: 1980

  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 7
  • - Article ID 254780

Comparison of Enameled Steel Substrate Properties for Thick Film Use

S. J. Stein | C. Huang | A. S. Gelb
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 7
  • - Article ID 951341

Stencil Screens for Fine-Line Printing

Stewart G. Stalnecker, Jr.
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 7
  • - Article ID 646432

Generalized Theory of Electrical Conductivity and Current Noise for Discontinuous Metal Films Over a Wide Range of Temperatures

M. Celasco | A. Masoero | ... | A. Stepanescu
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 7
  • - Article ID 708107

Hybrid Amplifier Modules for Nuclear Measurements in Space Flight Experiments

Walter Funk | Wolfgang Winkelnkemper
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 385924
  • - Short Communication

Helium Leak Measurements as a Predictor of Hermetic Package Life in Surgically-implanted Microelectronic Devices

P. E. K. Donaldson
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 869832

An Improved Thick Film Aluminium Conductor Process

R. E. Cooper | P. F. T. Linford | J. Savage
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 7
  • - Article ID 382317

Preparation and Properties of Thick Film Resistors Containing Cadmium Glasses and Cadmium Oxide

R. Kužel | J. Broukal
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 126854

Influence of the Substrate on the Electrical Properties of Thick-Film Resistors

A. Cattaneo | L. Pirozzi | ... | M. Prudenziati
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 273576

Some Observations on the Accelerated Ageing of Thick-Film Resistors

F. N. Sinnadurai | P. E. Spencer | K. J. Wilson
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 969801

Tantalum Thin Film Capacitors With Various Types of Counterelectrodes

G. P. Ferraris | R. May
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 454136

Thin-Film Resistors for Hybrid Integrated Circuits

Z. Kempisty | L. Kròl-Stępniewska | W. Posadowski
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 295097

A Computer Programme With Temperature Gradient Capability for the Network Analysis of Hybrid Circuits

Carl R. Zimmer
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 678532

New Light-Sensitive Positive-Working Thick Resist Materials for Various Electronic Applications

H. Ruckert
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 387216

Thin Film Al-Al2O3-Al Capacitors With Dielectric Layer Formed at 400℃

S. J. Osadnik | T. Berlicki
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 6
  • - Article ID 630492

Advances in Thick Film Conductors for Microwave Integrated Circuits

R. Wayne Johnson | Phil W. Rich | ... | Larry K. Wilson
Active and Passive Electronic Components
 Journal metrics
See full report
Acceptance rate10%
Submission to final decision90 days
Acceptance to publication14 days
CiteScore1.500
Journal Citation Indicator0.080
Impact Factor0.4
 Submit Evaluate your manuscript with the free Manuscript Language Checker

We have begun to integrate the 200+ Hindawi journals into Wiley’s journal portfolio. You can find out more about how this benefits our journal communities on our FAQ.